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Surface Mount Back flow Soldering Machine
In welding process, PCB is in static state/ The surface components should be in correct position, and avoid not be soldering.
Soldering zone use far infrared ray heat, and high temperature motor force to be heated.
Equip with nitrogen protection connector, and use nitrogen to make protection.
Soldering zone use fuzzy control technology, you can only set 3 units of technical parameter, then you can control the whole temperature curve, and you can follow temperature change, blue backlight LCD display.
It use 320×240mm dot matrix high resolution LCD display, the dimension of LCD is 113mm Dot matrix high resolution LCD80mm.
The solding machine can be connected to PC, and use backflow curve to record save software.
The welding machine has 4 ways temperature sensor interface, sensor head is PT100, it can correct welding temperature curve through backflow analysis
Dimension: 600×450×500mm
Peak power: 3.5KW
ISO 9001 Certified
Specifications match ASTM, BS, EN, IS & AASHTO standards for BOQ.
Sea/air-worthy packaging suitable for global tender shipments.
Installation and Training
Explore our complete catalog of Civil Engineering Lab Equipment, Industrial Testing Lab Equipment, Mechanical Engineering Lab Equipment and TVET Workshop Tools — engineered, calibrated and manufactured in India for global tender supply. As ISO 9001:2015 certified Surface Mount Back flow Soldering Machine suppliers and exporters to 50+ countries, Velocity Equipments delivers tender-ready BOQ pricing, ASTM/BS/EN/IS compliance and turnkey lab commissioning. Browse related products below to build a complete laboratory solution alongside your Surface Mount Back flow Soldering Machine requirement — or submit your tender BOQ for a fully-compliant 24-hour quotation.